Advanced Packaging Technology

                                        Cyntec’s technology platform of Electronic Materials Packaging for High Power Circuits, Heat Sink Design Simulation and High Current Metal Lead Frame, allowed us to produce a wide variety of Power Modules.

                                        Embedded substrate lamination material
                                        Copper lead frame surface treatment
                                        Ceramic substrate for direct copper bonding
                                        Encapsulation molding compound

                                        Design & Simulation:
                                        Power topology design and optimization
                                        Multi-physics coupling co-simulation
                                        Molding cavity design and mold ¬flow simulation

                                        Embedded active/passive 3D packaging
                                        Thin lm photolithography and electroplating
                                        Encapsulation process (molding, casing, dispensing)
                                        High density laser drilled via connections
                                        Au/Al wire bonding interconnection
                                        High precision die attaching
                                        High temp soldering SMT and vacuum re¬flow

                                        Packaging structure (X-ray, De-capsulation)
                                        Material property (SEM, EDX)
                                        Semiconductor reliability (EMMI, OBIRCH)
                                        Adhesion and thermal expansion property analysis
                                        Thermal conductivity and electrical isolation